Red Solder Mask 4 Layer PCB with ENIG Immersion Gold Finish
This 4-layer FR4 multilayer PCB combines a striking red LPI solder mask with an ENIG (Electroless Nickel Immersion Gold) surface finish, offering reliable interlayer registration, stable signal integrity and excellent solderability for demanding electronic products.
Key Features
- 4-layer FR4 stack-up with precise lamination and inner-layer registration
- Red solder mask with vivid, uniform color – great for brand-differentiated products
- ENIG finish (Ni 3–6μm / Au 0.05–0.1μm): flat surface, ideal for fine-pitch and BGA components
- Impedance control available (±10%) for high-speed signal designs
- 100% AOI inspection plus electrical testing; RoHS-compliant lead-free process
Technical Specifications
| Base Material | FR-4 (Tg 150–170 available) |
| Layer Count | 4 |
| Board Thickness | 1.6mm (0.8–3.2mm customizable) |
| Copper Thickness | 1oz outer / 0.5–1oz inner (2oz available) |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Solder Mask | Red LPI |
| Silkscreen | White |
| Min. Trace Width/Spacing | 3mil / 3mil (0.075mm) |
| Min. Hole Size | 0.2mm |
| Impedance Control | Optional, ±10% |
| Quality Standard | IPC Class 2 (IPC Class 3 available) |
| Certification | UL, ISO9001, RoHS |
Applications
Power supplies, industrial automation, communication equipment, automotive electronics, security systems and smart hardware.
Custom stack-up, blind/buried vias and panelization are supported. Send your Gerber files for a fast quotation.
