Custom Red Solder Mask 4-Layer ENIG PCB – High Density Multilayer Circuit Board
Engineered for compact, high-reliability designs, this high-density 4-layer PCB features a red LPI solder mask with ENIG (Electroless Nickel Immersion Gold) finish. Dense routing, gold-finished pads and 100% electrical testing deliver stable performance where space and reliability are critical.
Key Features
- High-density 4-layer design supports fine-pitch components and compact layouts
- ENIG finish (Ni 3–6μm / Au 0.05–0.1μm): ultra-flat pads, ideal for BGA, QFN and micro SMT packages
- Red solder mask with consistent, vivid appearance – perfect for visible or brand-critical assemblies
- Excellent anti-oxidation and long shelf life for stable, repeatable assembly
- 100% AOI + electrical test; RoHS compliant
Technical Specifications
| Base Material | FR-4 (Tg 150–170 available) |
| Layer Count | 4 |
| Board Thickness | 1.6mm (0.8–3.2mm customizable) |
| Copper Thickness | 1oz outer / 0.5–1oz inner (2oz available) |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Solder Mask | Red LPI |
| Silkscreen | White |
| Min. Trace Width/Spacing | 3mil / 3mil (0.075mm) |
| Min. Hole Size | 0.2mm |
| Impedance Control | Optional, ±10% |
| Quality Standard | IPC Class 2 (IPC Class 3 available) |
| Certification | UL, ISO9001, RoHS |
Applications
Automotive electronics, medical devices, smart hardware, communication modules, industrial control and consumer electronics.
Custom stack-up, blind/buried vias and panelization are supported. Send your Gerber files for a fast quotation.
